1. Thermo-mechanical characterization of evolving packaging materials and structures: presented at the 1998 ASME International Mechanical Engineering Congress and Exposition: November 15-20, 1998, Anaheim, California
پدیدآورنده :
کتابخانه: Central Library of Sharif University of Technology (Tehran)
موضوع : Testing ، Electronic packaging,، Electronic packaging-- Materials Fatigue,، Thermal stresses,، Deformation )Mechanics(
رده :
TK
7870
.
15
.
T483
1998
